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PCB Capabilities – Technology – Tolerances
Capabilities – Technology – Tolerances Standard Advanced
# of Circuit Layers 1 – 12 14+
Trace/Space (Outer Layers with 1/2 Oz Cu) .005″/.005″ .003″/.003″
Trace/Space (Inner Layer with 1 Oz Cu) .005″/.005″ .004″/.004″
Trace Width Tolerance: .005″ or smaller +/- .001″ +/- .001″
Trace Width Tolerance: .006″ or larger +/- .0015″ +/- .0015″
Trace/Space (2 Oz Cu) .010″/.010″ .008″/.008″
Preferred Copper Foil Starting Weight 1/2 OZ 1/2 OZ
Maximum Starting Weight Before Plating (Cu Foil) 2 OZ 3 OZ
Copper Distance to Board Edge – Inner Layer .020″ .010″
Copper Distance to Board Edge – Outer Layer .020″ .010″
Inner Layer Clearances Larger than Finish Hole Size .020″ .010″
Outer/Inner Layer Pad Size Larger than Finish Hole Size .020″ .010″
Layer to Layer Registration .007″ .005″
Tolerance on .062″ Overall Finished Thickness +/-.006″ +/-.005″
Minimum Board Thickness .025″ .014″
Minimum Core Thickness .004″ .003″
Pre-Preg Tolerance +/-.003″ +/-.002″
Min Finished Hole Size (.062″ Finished Thickness) .008″ .005″
Min Drilled Hole Edge to Drilled Hole Edge .020″ .015″
VIA & LAMINATION
Blind Vias Yes Yes
Micro Vias No Yes
Buried Vias Yes Yes
Sequential Lamination No Yes
Hole Aspect Ratio on .062″ Overall Thickness 10 to 1 12 to 1
SURFACE FINISH
Leaded Solder – HASL Surface Finish Yes Yes
Lead-Free Solder Surface Finish No Yes
ENIG (Electroless/Immersion Gold) Surface Finish Yes Yes
Immersion Silver Surface Finish Yes Yes
Gold Body – Gold Connectors/Fingers Yes Yes
ADDITIONAL CAPABILITIES
Edge Plating Yes Yes
Castellated Holes Yes Yes
LPI Solder Mask Registration .005″ .003″
LPI Solder Mask Dams between SMT Pads Spacing .010″ .005″
Controlled Impedance Yes Yes
Controlled Impedance Tolerance +/- 10% +/- 10%
Via Hole Plugging (non-conductive & conductive via fill) Yes Yes
MECHANICAL TOLERANCES
Routing Tolerance .010″ .005″
Scoring Tolerance .010″ .005″
Minimum Board Size .25″ x .25″ .25″ x .250″

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