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PCB Design Guidelines

Design Guidelines Standard Advanced
Maximum Layer Count 12 layers Up to 30 layers
MINIMUM TRACE WIDTH
½ oz Copper .005″ .003″
1 oz Copper .007″ .004″
2 oz Copper .010″ .008″
MINIMUM SPACE
½ oz Copper .006″ .004″
1 oz Copper .007″ .004″
2 oz Copper .010″ .008″
VIA & DRILL
Minimum Finished Via Hole Size .010″ .005″
Minimum Finished Via Pad Size .020″ .014″
Maximum Drill Aspect Ratio 10 to 1 12 to 1
TOLERANCES
Controlled Impedance Tolerance +/-10% +/-5%
Minimum Thickness Tolerance +/-10% or .007″ +/-5% or .004″
Minimum Finished Board Thickness .031″ .012″
Minimum Plated Through Hole Tolerance +/-.003″ +/-.002″
Minimum Non-Plated Hole Tolerance +/-.002″ +/-.001″
Minimum Routing Tolerance +/-.005″ +/-.005″
Minimum Warpage Tolerance .010″ / inch .005″ / inch
SOLDER MASK & LEGEND & INNER LAYER
Minimum Solder Mask Clearance .005″ .003″
Minimum Internal Inner Layer Clearance .012″ .008″
Minimum Dielectric Spacing between Inner Layers .005″ .003″
Legend Line Width .010″ .006″

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