Eagle Tech Inc
Time • Technology • Quality
Printed Circuit Solutions
SHOP TOLERANCE Production Standard Advanced Emerging
Minimum Outer Line Width .005 .004 .0035 .003
Minimum Inner Line Width .005 .004 .0035 .003
Minimum Outer Space
Trace / Trace
.005 .004 .0035 .003
Minimum Inner Space,
Trace / Trace
.004 .004 .003 < .003
Minimum Outer Space,
Trace / Pad
.005 .004 .003 < .003
Minimum Inner Space,
Trace / Pad
.004 .004 .003 <.003
Layer-to-Layer Registration + - .005 + - .005 + - .003 + - .002
Maximum Finished PCB Thickness .187 .250 .265 > .300
Minimum Board Thickness Tolerance + - 10% + - 10% 5% < 5%
Dimensions - Hole Location + - .003 + - .003 + - .002 - + .001
Dimensions - Fab O.D. + - .010 + - .010 + - .005 - + .003
Fabrication Radius + - 5 Degrees + - 5 Degrees + - 5 Degrees + - 5 Degrees
Warpage (inch per inch) (flatness of finished board) .010 .008 .005 .003
Minimum Dielectric Thickness .004 .004 .002 .001
Maximum Number of Layers 20 38 >40 >50
 
PAD TO HOLE SIZE Production Standard Advanced Emerging
Minimum Plated Hole Size * (Finished) .010 .006 .004 < .004
Tolereance - Plated Hole Size + - .003 + - .003 + - .002 + - .001
Minimum Inner Layer Pad
1 mil annular ring)
+ - .018
OVER F.H.S.
+ - .018
OVER F.H.S.
+ .012 OVER F.H.S. + .008 OVER F.H.S.
Mech. Min. Drill Hole Size .010 .010 .006 < .006
Normal Finished Hole Size .010 .008 .004 < .004
Plane Relief Diameter Over Drilled Hole .024 .020 .016 .010
Minimum Outer Layer Pad
(1 mil annular ring)
.012
OVER F.H.S.
.010
OVER F.H.S.
.008
OVER F.H.S.
.006
OVER F.H.S.
Min. Outer Non-Plated Hole to Metal .010 .010 .006 < .006
Min. Inner Non-Plated Hole to Metal .010 .010 .006 < .006
Max. Number holes/sq. in. (average over board) 200 250 300 + 500 +
* On particular sizes holes less than 50 mil in diameter
 
DRILLING Production Standard Advanced Emerging
Maximum Aspect Ratio 13:1 24:1 25:1 >>31:1
 
TESTING CAPABILITIES
Flying Probe Testing Minimum Pitch:.005
Minimum feature size:.002
Universal Grid Tester (UGT)
N/A
 
SOLDERMASK CRITERIA Production Standard Advanced Emerging
SMT Minimum Pad Spacing .008 .008 .007 .007
Line to SMT Minimum Space .005 .004 .003 .003
Minimum Soldermask Rib .005 .005 .004 .003
 
SURFACE FINISHES AVAILABLE
HASL Minimum Thickness .0003 .0003 .0002 N/A
HASL Maximum Thickness .0015 .0015 .001 N/A
HASL Co-Plan + - 1000 UIN + - 1000 UIN + - 500 UIM N/A
Electrolytic Hard Gold Maximum Thickness 50 UIN 50 UIN 75 UIN 100 UIN
Electrolytic Soft Gold Maximum Thickness 40 UIN 40 UIN 50 UIN N/A
Electroless Gold Maximum Thickness 30 30 UIN 30 UIN 30 UIN
Immersion Gold Thickness 8 UIN 8 UIN 8 UNI 8 UIN
Immersion Silver Thickness 10-20 UIN 10-20 UIN 10-20 UIN 10-20 UIN
Immersion Tin Thickness 30-50 UIN 30-50 UIN 30-50 UIN 30-50 UIN
OSP ENTEK 106 HT 3.5 UIN 3.5 UIN 3.5 UIN 3.5 UIN
 
MINIMUM CORE .004 .004 .003 .002
 
ELECTRICAL CHARACTERISTICS
Impedance Tolerance * + - 10% + - 10% + - 5% + - 3%
* Note: 28 ohms technology
 
MATERIALS AVAILABLE Production Standard Advanced Emerging
FR-4 Tg 170 YES
Getek 180 YES
Nelco 4000-13 180 YES
Allied 408 180 YES
Polyimide 260 YES
BT Epoxy 180 Call for information Call for information Call for information Call for information
Cyanate Ester 250 YES
RCC 160 Call for information Call for information Call for information Call for information
Teflons YES
Rogers YES
Taconics YES
Arlon YES
Others (including Flex) Call for information Call for information Call for information Call for information
LD621
LEAD FREE N4000-11
LEAD FREE N4000-12
LEAD FREE FR4 370 HR