SHOP TOLERANCE |
Production |
Standard |
Advanced |
Emerging |
Minimum Outer Line Width |
.005 |
.004 |
.0035 |
.003 |
Minimum Inner Line Width |
.005 |
.004 |
.0035 |
.003 |
Minimum Outer Space
Trace / Trace |
.005 |
.004 |
.0035 |
.003 |
Minimum Inner Space,
Trace / Trace |
.004 |
.004 |
.003 |
< .003 |
Minimum Outer Space,
Trace / Pad |
.005 |
.004 |
.003 |
< .003 |
Minimum Inner Space,
Trace / Pad |
.004 |
.004 |
.003 |
<.003 |
Layer-to-Layer Registration |
+ - .005 |
+ - .005 |
+ - .003 |
+ - .002 |
Maximum Finished PCB Thickness |
.187 |
.250 |
.265 |
> .300 |
Minimum Board Thickness Tolerance |
+ - 10% |
+ - 10% |
5% |
< 5% |
Dimensions - Hole Location |
+ - .003 |
+ - .003 |
+ - .002 |
- + .001 |
Dimensions - Fab O.D. |
+ - .010 |
+ - .010 |
+ - .005 |
- + .003 |
Fabrication Radius |
+ - 5 Degrees |
+ - 5 Degrees |
+ - 5 Degrees |
+ - 5 Degrees |
Warpage (inch per inch) (flatness of finished board) |
.010 |
.008 |
.005 |
.003 |
Minimum Dielectric Thickness |
.004 |
.004 |
.002 |
.001 |
Maximum Number of Layers |
20 |
38 |
>40 |
>50 |
|
PAD TO HOLE SIZE |
Production |
Standard |
Advanced |
Emerging |
Minimum Plated Hole Size * (Finished) |
.010 |
.006 |
.004 |
< .004 |
Tolereance - Plated Hole Size |
+ - .003 |
+ - .003 |
+ - .002 |
+ - .001 |
Minimum Inner Layer Pad
1 mil annular ring) |
+ - .018
OVER F.H.S. |
+ - .018
OVER F.H.S. |
+ .012 OVER F.H.S. |
+ .008 OVER F.H.S. |
Mech. Min. Drill Hole Size |
.010 |
.010 |
.006 |
< .006 |
Normal Finished Hole Size |
.010 |
.008 |
.004 |
< .004 |
Plane Relief Diameter Over Drilled Hole |
.024 |
.020 |
.016 |
.010 |
Minimum Outer Layer Pad
(1 mil annular ring) |
.012
OVER F.H.S. |
.010
OVER F.H.S. |
.008
OVER F.H.S. |
.006
OVER F.H.S. |
Min. Outer Non-Plated Hole to Metal |
.010 |
.010 |
.006 |
< .006 |
Min. Inner Non-Plated Hole to Metal |
.010 |
.010 |
.006 |
< .006 |
Max. Number holes/sq. in. (average over board) |
200 |
250 |
300 + |
500 + |
* On particular sizes holes less than 50 mil in diameter |
|
DRILLING |
Production |
Standard |
Advanced |
Emerging |
Maximum
Aspect Ratio |
13:1 |
24:1 |
25:1 |
>>31:1 |
|
TESTING
CAPABILITIES |
Flying
Probe Testing |
Minimum
Pitch:.005 |
Minimum feature size:.002 |
Universal Grid Tester (UGT) |
N/A |
|
SOLDERMASK
CRITERIA |
Production |
Standard |
Advanced |
Emerging |
SMT Minimum Pad Spacing |
.008 |
.008 |
.007 |
.007 |
Line to SMT Minimum Space |
.005 |
.004 |
.003 |
.003 |
Minimum Soldermask Rib |
.005 |
.005 |
.004 |
.003 |
|
SURFACE
FINISHES AVAILABLE |
HASL
Minimum Thickness |
.0003 |
.0003 |
.0002 |
N/A |
HASL Maximum Thickness |
.0015 |
.0015 |
.001 |
N/A |
HASL Co-Plan |
+ - 1000 UIN |
+ - 1000 UIN |
+ - 500 UIM |
N/A |
Electrolytic Hard Gold Maximum Thickness |
50 UIN |
50 UIN |
75 UIN |
100 UIN |
Electrolytic Soft Gold Maximum Thickness |
40 UIN |
40 UIN |
50 UIN |
N/A |
Electroless Gold Maximum Thickness |
30 |
30 UIN |
30 UIN |
30 UIN |
Immersion Gold Thickness |
8 UIN |
8 UIN |
8 UNI |
8 UIN |
Immersion Silver Thickness |
10-20 UIN |
10-20 UIN |
10-20 UIN |
10-20 UIN |
Immersion Tin Thickness |
30-50 UIN |
30-50 UIN |
30-50 UIN |
30-50 UIN |
OSP ENTEK 106 HT |
3.5 UIN |
3.5 UIN |
3.5 UIN |
3.5 UIN |
|
MINIMUM CORE |
.004 |
.004 |
.003 |
.002 |
|
ELECTRICAL CHARACTERISTICS |
Impedance Tolerance * |
+ - 10% |
+ - 10% |
+ - 5% |
+ - 3% |
* Note: 28 ohms technology |
|
MATERIALS AVAILABLE |
Production |
Standard |
Advanced |
Emerging |
FR-4 Tg |
170 |
|
YES |
|
|
Getek |
180 |
|
YES |
|
|
Nelco 4000-13 |
180 |
|
YES |
|
|
Allied 408 |
180 |
|
YES |
|
|
Polyimide |
260 |
|
YES |
|
|
BT Epoxy |
180 |
Call for information |
Call for information |
Call for information |
Call for information |
Cyanate Ester |
250 |
|
YES |
|
|
RCC |
160 |
Call for information |
Call for information |
Call for information |
Call for information |
Teflons |
|
YES |
|
|
Rogers |
|
YES |
|
|
Taconics |
|
YES |
|
|
Arlon |
|
YES |
|
|
Others (including Flex) |
Call for information |
Call for information |
Call for information |
Call for information |
LD621 |
LEAD FREE N4000-11 |
LEAD FREE N4000-12 |
LEAD FREE FR4 370 HR |